Thursday, 30 July 2015

Wirebonding in EDWinNET

AsPacker is a tool that aids the designer integrate bare die or chips into their projects. AsPacker automates the process eliminating errors that can be made during hand editing a package layout.The Wire Bond Explorer allows the packaging engineer to parametrically design the fan out pattern for a die. This tool also has a 3D Viewer allowing the designer to see the design from all angles. Cross referencing between the netlist and die is also available. Outputs in clued DXF format as well as an enhanced LIQ formatthat is currently accepted by PADS & EDWinNET.
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.
EDWinNET can now fabricate multichip modules from AsPacker.
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